Webinar: Ansys PCB Multiphysics Simulation Workflows Webinar (May 2021)

This content includes a recording of DRD’s webinar conducted on May 6, 2021. The video includes a presentation of PCB thermal stress simulation using ANSYS SIwave, Icepak, and Mechanical. Additionally, the presentation includes content on using ANSYS Sherlock for PCB reliability studies. The methodologies demonstrated can assist engineers with the questions ‘how hot does my PCB get under a certain operating condition and thermal environment?’, as well as ‘what is the predicted board life?’. DRD presents the DCIR drop EM simulation along with a conjugate heat transfer simulation to calculate the resultant temperature distribution in a PCB. DRD also presents a PCB reliability model for predicting board life.