Webinar: Accurate PCB Reliability Predictions for Thermal Cycling

This webinar, conducted on May 2, 2024, electronics that are exposed to fluctuating temperatures undergo a process known as thermal cycling. These fluctuations in temperature cause the PCB and it’s components to expand and contract with the rise and fall of temperature. The various materials used electronics will expand and contract at different rates due to a mismatch in the coefficient of thermal expansion, which leads to mechanical stresses in the solder joints.